Using the latest high performance Ultra bright LED lamps technology from InGaN and InAlGaP “TS” LED structures an increasing number of new applications can be realised. A range of technologies, materials and components are adopted to suit the application processes, these include Injection Moulding, Chip-on-board, Surface Mount and through hole.

With the unique characteristics of LED products, it is of paramount importance that we control the quality particularly with respect to the consistency, grading and matching of light sources. Many of our customers have applications that demand this approach and we control this by selection, test and burn-in.

As cost increasingly becomes a key factor, utilising partnerships with a number of our principals based in Asia brings together the benefits of product management, from raw material procurement through prototype and manufacture, to test and finished product. Cost analysis can be provided from concept, drawings, and or samples for evaluation.